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Modular data acquisition architecture for thin-film sensors surfaces

dc.contributor.authorRodrigues, Nelson
dc.contributor.authorLima, José
dc.contributor.authorRodrigues, Pedro João
dc.contributor.authorCarvalho, José Augusto
dc.contributor.authorLaranjeira, Jorge
dc.contributor.authorMaidana, Wellington
dc.contributor.authorLeitão, Paulo
dc.date.accessioned2023-03-03T09:30:31Z
dc.date.available2023-03-03T09:30:31Z
dc.date.issued2020
dc.description.abstractThin-film sensors surfaces are becoming popular to collect data in several specific and complex processes, namely plastic injection or metal stamping, allowing the digitization of such processes through the use of Internet of Things technologies. A particular challenge in such thin-film sensors surfaces is the data acquisition and signal conditioning system, which implementation is complex due to the characteristics of these sensors (e.g., low amplitude and noisy signals), but even more complex when implemented in real industrial processes, which are subject to harsh conditions, namely noise, dirt and aggressive elements. This work describes a modular data acquisition and signals conditioning system for thin-film sensors surfaces, meeting the requirements of scalability, robustness and low-cost, meaning that it can be easily expanded according to the number of sensors required for the application scenario.pt_PT
dc.description.sponsorshipThe work reported in this paper was supported by ONSURF- Mobilizar Competências Tecnológicas em Engenharia de Superfícies, Projeto n.o POCI-01-0247-FEDER-024521.pt_PT
dc.description.versioninfo:eu-repo/semantics/publishedVersionpt_PT
dc.identifier.citationRodrigues, Nelson; Lima, José; Rodrigues, Pedro João; Carvalho, José Augusto; Laranjeira, Jorge; Maidana, Wellington; Leitão, Paulo (2020). Modular data acquisition architecture for thin-film sensors surfaces. In 29th IEEE International Symposium on Industrial Electronics, ISIE 2020. Delftpt_PT
dc.identifier.doi10.1109/ISIE45063.2020.9152518pt_PT
dc.identifier.urihttp://hdl.handle.net/10198/27426
dc.language.isoengpt_PT
dc.peerreviewedyespt_PT
dc.publisherIEEEpt_PT
dc.relationOCI-01-0247-FEDER-024521pt_PT
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/pt_PT
dc.subjectData acquisition and signal conditioningpt_PT
dc.subjectThin-film sensors surfacespt_PT
dc.subjectIndustry 4.0pt_PT
dc.titleModular data acquisition architecture for thin-film sensors surfacespt_PT
dc.typeconference paper
dspace.entity.typePublication
oaire.citation.conferencePlaceDelftpt_PT
oaire.citation.endPage515pt_PT
oaire.citation.startPage510pt_PT
oaire.citation.title29th IEEE International Symposium on Industrial Electronics, ISIE 2020pt_PT
person.familyNameLima
person.familyNameRodrigues
person.familyNameCarvalho
person.familyNameMaidana
person.familyNameLeitão
person.givenNameJosé
person.givenNamePedro João
person.givenNameJosé Augusto
person.givenNameWellington
person.givenNamePaulo
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person.identifier.orcid0000-0001-7902-1207
person.identifier.orcid0000-0002-0555-2029
person.identifier.orcid0000-0002-6074-8112
person.identifier.orcid0000-0002-5361-3850
person.identifier.orcid0000-0002-2151-7944
person.identifier.ridL-3370-2014
person.identifier.ridD-1215-2019
person.identifier.scopus-author-id55851941311
person.identifier.scopus-author-id27168377100
person.identifier.scopus-author-id57214233736
person.identifier.scopus-author-id35584388900
rcaap.rightsopenAccesspt_PT
rcaap.typeconferenceObjectpt_PT
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