ESTiG - Resumos em Proceedings Não Indexados à WoS/Scopus
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Browsing ESTiG - Resumos em Proceedings Não Indexados à WoS/Scopus by Subject "3D printing"
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- Manufacture and development of a 3D printing handle for laparoscopic applicationPublication . Ariati, Ronaldo; Rocha, Catarina; Ribeiro, J.E.; Rocha, Joãoapproximately a century ago and due to its advantages, such as the rapid recovery of patients, it has become the focus of several studies for the improvement of the equipment and the technique. However, the equipment has a serious ergonomic problem in its configuration, which causes several musculoskeletal problems for surgeons causing, for example, muscle pain, temporary paresthesia, and fatigue, among other long-term pathologies. The study and development of new handle models and the reduction of the forces required for their manipulation are of fundamental importance in the field of laparoscopy. In this sense, this work presents the integration of the product development method of Pahl and Beitz (2007) and the DSR (Design Science Research) method for the development of a laparoscopic instrument, to be applied in tweezers and scissors, that meets the ergonomic requirements presented in the literature.
- Mechanical characterization of specimens manufactured in 3D printingPublication . Ariati, Ronaldo; Rocha, Catarina; Ribeiro, J.E.The use of additive manufacturing (3D printers) in the direct fabrication of commercial items is widespread, owing to the advancements and popularization of computer design programs (CAD) and 3D printers, particularly in the previous 10 years. Shimadzu Autograph AGS - X series universal testing machine was used for both tests. PLA+ can withstand larger stresses than ABS, with 44.2% and 25.73% higher tensile and yield strains, respectively. The modulus of elasticity of PLA+ is shown to be 61.99% greater than that of ABS. The goal of this study is to describe the most often used materials and procedures in 3D printing, as well as to characterize ABS and PLA polymers through tensile testing.