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Please use this identifier to cite or link to this item: http://hdl.handle.net/10198/1852

Título: Measurement of residual stresses with optical techniques
Autor: Ribeiro, J.E.
Monteiro, Jaime
Vaz, M.A.P.
Lopes, H.
Piloto, P.A.G.
Palavras-chave: Eelectronic speckle pattern interferometry
Finite-element method
Hole drilling
Residual stresses
Moiré interferometry
Issue Date: 2009
Editora: Wiley Blackwell
Citação: Ribeiro, J.E.; Strain: Monteiro, Jaime; Vaz, M.A.P.; Lopes, H.; Piloto, P.A.G. (2009) - Measurement of residual stresses with optical techniques. Strain: An International Journal for Experimental Mechanics. ISSN 1475-1305. 45:2 p. 123-130
Resumo: The goal of this work was the development of other experimental techniques to measure residual stresses, as an alternative to the hole-drilling method with strain gauges. The proposed experimental techniques are based on the use of Moiré interferometry and in-plane electronic speckle pattern interferometry (ESPI). Both are field techniques allowing the assessment of in-plane displacements without contact and high resolution. Grating replication techniques were developed to record high-quality diffraction gratings onto the specimen's surfaces. An optical set-up of laser interferometry was developed to generate the master grating (virtual). An in-plane ESPI set-up was also designed and implemented to measure displacements in one direction. The stress relaxation was promoted by the blind hole-drilling and the obtained fringe patterns (Moiré and speckle) were video-recorded. Image processing techniques were applied to assess the in-plane strain field. A finite-element code (ansys®) was used to simulate the stress relaxation process, whose values were compared with the experimental data, and to calculate the hole-drilling calibration constants.
URI: http://hdl.handle.net/10198/1852
ISSN: 0039-2103
Versão do Editor: http://www3.interscience.wiley.com/journal/117985070/home
Appears in Collections:DMA - Artigos em Revistas Indexados ao ISI
DTM - Artigos em Revistas Indexados ao ISI

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