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Thermomechanical behaviour of bonding joints of wood and wood-based panels at room temperature and elevated temperatures

2023Conference paper Open access
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dc.contributor.authorAlves, Matheus Henrique
dc.contributor.authorAndrade, Djems
dc.contributor.authorMesquita, L.M.R.
dc.contributor.authorBarreira, Luísa
dc.contributor.authorManhique, Jocyla
dc.contributor.authorSantamaria-Echart, Arantzazu
dc.contributor.authorBarreiro, M.F.
dc.contributor.authorMofreita, Filipe
dc.date.accessioned2024-02-14T11:20:11Z
dc.date.available2024-02-14T11:20:11Z
dc.date.issued2023
dc.description.abstractWood is a natural material traditionally used in the construction industry. In recent decades, developments in scientific research have turned wood into a high-tech construction resource. Increased interest in bonded joints in wood construction is due to the advantages of adhesive technology compared to traditional mechanical joining techniques. It is very important to understand the influence of elevated temperatures on adhesives due to their use in multilayer systems such as compartmentation walls and fire-resistant doors, which require adequate mechanical and thermal resistance in fire situations. The purpose of this study is to investigate the mechanical behaviour of different structural adhesives on bonded connections of wood and wood-based panels at room and elevated temperatures through experimental testing. The performance of the adhesives was evaluated at room temperature and at 50 °C, 100 °C, 150 °C, and 200 °C. The resins tested were a polyurethane prepolymer resulting from the reaction between polyols and diphenylmethane diisocyanate (MDI), Flexpur151, and urea resin glue for hot pressing. The tensile shear tests with lap joints were performed using combinations of pinewood-pinewood and MDF-MDF. The experimental tests were done according to EN 205:2016, which allows for determining the tensile shear strength of bonded joints. The failure mode of the tested specimens was classified according to ASTM D5573. The results show that the bonding strength and the displacement of the specimens decrease with the increase of the temperature. The failure mode presents a different result for different temperatures. For example, for the urea resin, the shear resistance of MDF-MDF panels decreases about 50 % when exposed to 100 ºC with the failure mode usually occurring on the panel, and 98 % when exposed to 200 ºC with the failure mode in the adhesion plane. For the MDI based resin, the shear resistance of MDF-MDF panels decreases about 35 % when exposed to 100 ºC with the failure usually occurring on the panel, and 65 % when exposed to 200 ºC with the failure mode occurring in the adhesion plane.pt_PT
dc.description.sponsorshipThis work was developed within the scope of the project NORTE-01-0247-FEDER-072225, supported by North Portugal Regional Operational Programme (NORTE 2020), under the PORTUGAL 2020 Partnership Agreement, through the European Regional Development Fund (ERDF), CIMO (UIDB/00690/2020) funded by FCT/MCTES (PIDDAC), FCT, P.I., through the institutional scientific employment program-contract for Arantzazu Santamaria.pt_PT
dc.description.versioninfo:eu-repo/semantics/publishedVersionpt_PT
dc.identifier.citationAlves, Matheus Henrique; Andrade, Djems; Mesquita, L.M.R.; Barreira, Luísa; Manhique, Jocyla; Santamaria-Echart, Arantzazu; ; Barreiro, M.F.; Mofreita, Filipe (2023). Thermomechanical behaviour of bonding joints of wood and wood-based panels at room temperature and elevated temperatures. In 7th World Multidisciplinary Civil Engineering-Architecture-Urban Planning Symposium (WMCAUS). ISSN 0094-243X. 2990:1, p. 1-9pt_PT
dc.identifier.doi10.1063/5.0171441pt_PT
dc.identifier.issn0094-243X
dc.identifier.urihttp://hdl.handle.net/10198/29485
dc.language.isoengpt_PT
dc.peerreviewedyespt_PT
dc.publisherAmerican Institute of Physicspt_PT
dc.relationMountain Research Center
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/pt_PT
dc.subjectCross laminated timberpt_PT
dc.subjectGlulampt_PT
dc.subjectLaminatingpt_PT
dc.titleThermomechanical behaviour of bonding joints of wood and wood-based panels at room temperature and elevated temperaturespt_PT
dc.typeconference paper
dspace.entity.typePublication
oaire.awardTitleMountain Research Center
oaire.awardURIinfo:eu-repo/grantAgreement/FCT/6817 - DCRRNI ID/UIDB%2F00690%2F2020/PT
oaire.citation.endPage9pt_PT
oaire.citation.issue1pt_PT
oaire.citation.startPage1pt_PT
oaire.citation.title7th World Multidisciplinary Civil Engineering-Architecture-Urban Planning Symposium (WMCAUS)pt_PT
oaire.citation.volume2990pt_PT
oaire.fundingStream6817 - DCRRNI ID
person.familyNameAlves
person.familyNameMesquita
person.familyNameBarreira
person.familyNameManhique
person.familyNameSantamaria-Echart
person.familyNameBarreiro
person.givenNameMatheus Henrique
person.givenNameLuís M.R.
person.givenNameLuísa
person.givenNameJocyla
person.givenNameArantzazu
person.givenNameFilomena
person.identifier1339117
person.identifier.ciencia-idDA1E-F1FC-B91E
person.identifier.ciencia-id401E-2FEC-8303
person.identifier.ciencia-id 5C16-CCB5-F4F3
person.identifier.ciencia-id261C-F0BB-8459
person.identifier.ciencia-id0C17-1E1F-2621
person.identifier.ciencia-id3418-47D5-5746
person.identifier.orcid0000-0001-8139-6761
person.identifier.orcid0000-0002-2385-4282
person.identifier.orcid0000-0003-0599-1280
person.identifier.orcid0000-0003-0107-7301
person.identifier.orcid0000-0002-6844-333X
person.identifier.ridF-2269-2010
person.identifier.ridL-9802-2014
person.identifier.scopus-author-id8585923500
person.identifier.scopus-author-id56725697700
person.identifier.scopus-author-id57188719717
project.funder.identifierhttp://doi.org/10.13039/501100001871
project.funder.nameFundação para a Ciência e a Tecnologia
rcaap.rightsopenAccesspt_PT
rcaap.typeconferenceObjectpt_PT
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