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Title: Measuring displacement field and detection of unbonded regions in a single lap joint with Moiré intereferometry
Author: Ribeiro, J.E.
Vaz, M.A.P.
Lopes, H.
Monteiro, J.
Piloto, P.A.G.
Issue Date: 2006
Citation: Ribeiro, J.E.; Vaz, M.A.P.; Lopes, H.; Monteiro,J.; Piloto, P.A.G. (2006) - Measuring displacement field and detection of unbonded regions in a single lap joint with moiré intereferometry. In International Congress on Full Measurement Techniques and their Applications in Experimental Solid Mechanics (Photomechanics 2006). Clermont-Ferrand, França.
Abstract: Adhesives are increasingly being used to replace traditional fastening methods in industrial applications such as welding, bolts and rivets. In cars and other transport applications, weight reduction is a key factor in new developments, hence the use of lightweight adhesives is rapidly expanding. Adhesives are used to bond many different material types including ceramics, metals, glass, plastics and composites. The key advantages of adhesives include the distribution of loads across the entire joint area, excellent fatigue properties, attenuation of mechanical vibrations and noise, sealant functions, reduction in galvanic corrosion between dissimilar metals, and a faster more cost-effective assembly method. The goal of this work is the development of an experimental technique to measure the displacement field and to perform detection of unbonded regions in a single lap joint. The proposed experimental technique is based on the use of Moiré Interferometry.
Peer review: yes
Appears in Collections:DMA - Posters em Encontros Científicos Internacionais

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